From LED to Solid State Lighting
-15%
portes grátis
From LED to Solid State Lighting
Principles, Materials, Packaging, Characterization, and Applications
Lee, S. W. Ricky; Ye, Huaiyu; Lo, Jeffery C. C.; Tao, Mian
John Wiley & Sons Inc
10/2021
256
Dura
Inglês
9781118881477
15 a 20 dias
600
Descrição não disponível.
Preface v
About the Authors vii
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.3 Chip Mounting and Interconnection 20
2.4 Phosphor Coating and Dispensing Process 38
2.5 Encapsulation and Molding Process 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies forWafer Level Packaging 66
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.5 Processes of LED Wafer Level Packaging 96
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.2 Power Supply and Efficiency 159
5.3 Consideration of LED Thermal Performance 163
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.2 Failure Analysis and Life Assessment 181
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.2 Micro- and Mini-LED Display 194
7.3 LED for Visible Light Communication 203
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV-LED 213
8.2 Applications of IR-LEDs 225
8.3 Future Outlook and Other Technology Trends 233
References 235
Index 243
About the Authors vii
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.3 Chip Mounting and Interconnection 20
2.4 Phosphor Coating and Dispensing Process 38
2.5 Encapsulation and Molding Process 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies forWafer Level Packaging 66
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.5 Processes of LED Wafer Level Packaging 96
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.2 Power Supply and Efficiency 159
5.3 Consideration of LED Thermal Performance 163
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.2 Failure Analysis and Life Assessment 181
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.2 Micro- and Mini-LED Display 194
7.3 LED for Visible Light Communication 203
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV-LED 213
8.2 Applications of IR-LEDs 225
8.3 Future Outlook and Other Technology Trends 233
References 235
Index 243
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Light source technology; thermal (incandescent); discharge (fluorescent and HID) lamps; light-emitting diode (LED)-based solid-state lighting (SSL); practically-based overview; design and construction of LED lighting modules; fabrication; LED chip; LED modules; LED lighting fixtures; Solid-state lighting (SSL); energy saving; environmental friendliness; long operational life; Packaging of light-emitting diode (LED); interconnection; phosphor deposition; encapsulation; thermal management and reliability; optical design; analysis and characterization; Applications of LED; Overview on Lighting; Photometry; Colorimetry; Fabrication of LED Wafers and Chips; Wafer Level Packaging of LED Arrays; Board Level Assembly and LED Modules; Reliability Engineering for LED Packaging
Preface v
About the Authors vii
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.3 Chip Mounting and Interconnection 20
2.4 Phosphor Coating and Dispensing Process 38
2.5 Encapsulation and Molding Process 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies forWafer Level Packaging 66
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.5 Processes of LED Wafer Level Packaging 96
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.2 Power Supply and Efficiency 159
5.3 Consideration of LED Thermal Performance 163
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.2 Failure Analysis and Life Assessment 181
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.2 Micro- and Mini-LED Display 194
7.3 LED for Visible Light Communication 203
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV-LED 213
8.2 Applications of IR-LEDs 225
8.3 Future Outlook and Other Technology Trends 233
References 235
Index 243
About the Authors vii
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.3 Chip Mounting and Interconnection 20
2.4 Phosphor Coating and Dispensing Process 38
2.5 Encapsulation and Molding Process 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies forWafer Level Packaging 66
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.5 Processes of LED Wafer Level Packaging 96
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.2 Power Supply and Efficiency 159
5.3 Consideration of LED Thermal Performance 163
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.2 Failure Analysis and Life Assessment 181
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.2 Micro- and Mini-LED Display 194
7.3 LED for Visible Light Communication 203
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV-LED 213
8.2 Applications of IR-LEDs 225
8.3 Future Outlook and Other Technology Trends 233
References 235
Index 243
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Light source technology; thermal (incandescent); discharge (fluorescent and HID) lamps; light-emitting diode (LED)-based solid-state lighting (SSL); practically-based overview; design and construction of LED lighting modules; fabrication; LED chip; LED modules; LED lighting fixtures; Solid-state lighting (SSL); energy saving; environmental friendliness; long operational life; Packaging of light-emitting diode (LED); interconnection; phosphor deposition; encapsulation; thermal management and reliability; optical design; analysis and characterization; Applications of LED; Overview on Lighting; Photometry; Colorimetry; Fabrication of LED Wafers and Chips; Wafer Level Packaging of LED Arrays; Board Level Assembly and LED Modules; Reliability Engineering for LED Packaging
